Matrixboard with Ground Plane Hot air levelled Through holes have etched-free ring on ground plane side to provide isolated ground plane on component side Plated through holes for both DIN connector and PCB matrix (RE334 only) Ground plane designed to reduce EMI problems in high frequency circuits Connector type DIN 41612 (C-96/abc) Epoxy Glass Double sided Board size 100 x 160 x 1.5mm Hole pitch 2.54mm (0.1 in) Hole dia 1.0mm Copper thickness 35μm DIN 类型矩阵板 矩阵板,带有 1 mm 的孔,节距为 2.54 mm。
参数 | 值 |
---|---|
型号编码 | RE334-LF |
说明 | Matrixboard with Ground Plane Hot air levelled Through holes have etched-free ring on ground plane side to provide isolated ground plane on component side Plated through holes for both DIN connector and PCB matrix (RE334 only) Ground plane designed to reduce EMI problems in high frequency circuits Connector type DIN 41612 (C-96/abc) Epoxy Glass Double sided Board size 100 x 160 x 1.5mm Hole pitch 2.54mm (0.1 in) Hole dia 1.0mm Copper thickness 35μm DIN 类型矩阵板 矩阵板,带有 1 mm 的孔,节距为 2.54 mm。 |
品牌 | Roth Elektronik |
封装 | - |
分类 | 型号 |
---|---|
RE012-LF | |
开发套件 > | RE200-LF |
开发套件 > | RE210-S1 |
开发套件 > | RE933 |
开发套件 > | RE200-LFDS |
开发套件 > | RE320-LF |
RE317-HP | |
RE220-LF | |
RE510-S1 | |
RE321-LF | |
RE931 | |
RE201-LFDS | |
RE437-LF | |
RE210-S2 | |
RE315-HP | |
RE520-HP | |
开发套件 > | RE900 |
开发套件 > | RE200-HP |
开发套件 > | RE510-S2 |
开发套件 > | RE460 |
开发套件 > | RE510-S3 |